Custom Test & Manufacturing Services

Manufacturing Brochure PDF

Custom Manufacturing Services

  • Build to print hybrids
  • Microcircuit assembly and contract manufacturing
  • Custom microcircuit design
  • Proto-Typing and Pre-Production
    • Leader In Thin-Film manufacturing performing to ISO9001 and MIL-PRF-38534 Specifications

Test Services - DC to 3Ghz

  • HP9494 Mixed Signal Tester
  • Teradyne A570 Mixed Signal Tester
  • Trillium Array Master Mixed Signal Tester
  • LTX TS88 Analog/Digital Tester with LTX 84 Laser Trim and Probe
  • Rack and Stack Mixed Signal Tester
  • Environmental screening Build to print hybrids

Standard Manufacturing Flow

  • In-house fabrication
  • Passive trim (0.1% tolerance)
  • Epoxy die attach
  • Pre-wire bond plasma clean
  • HP test equipment
  • YAG laser
  • Wire bond
  • 1 mil gold wire
  • Thermosonic ball bonding
  • Auto wire bonder
  • Active trim/pre-seal test

Sealing and Screening Options

  • Parallel resistance welding
  • Epoxy seal
  • Constant acceleration
  • Solder dip leads
  • Thermal shock
  • Projection welding
  • Fine and gross leak
  • Package mark
  • PIND test
  • Burn-in
  • PDA

新产品

CLC2011 Dual, Low Power, Low Cost, Rail-to-Rail I/O Amplifier

CLC1002 单路,超低噪声放大器

CLC1006 单路,500MHz,电压反馈型放大器

CLC1606 1.3GHz 电流反馈型放大器

CDK3405 8-bit, 180MSPS, Triple Video DAC

CDK2307D 12/13位、80MSPS、双路 ADC

CDK8307E 12/13-bit, 80MSPS, Octal ADC with LVDS